Study on B-stage properties of wafer level underfills

Journal of Adhesion Science and Technology

Volumn 18, Issue 3, 2004, Pages 361-380

  Zhang, Zhuqing ^a   Sun, Yangyang ^a   Fan, Lianhua ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

B stage; Cure kinetics; Flip chip; Underfill; Wafer level

Indexed keywords

CURING; INTEGRATED CIRCUIT MANUFACTURE; JOINTS (STRUCTURAL COMPONENTS); STRESS ANALYSIS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION; COAGULATION; DIAMOND CUTTING TOOLS; GELATION;

ORGANIC SUBSTRATES; PRINTED WIRING BOARDS (PWB); THERMAL-MECHANICAL STRESS; WAFER LEVEL UNDERFILLS;

FLIP CHIP DEVICES;

B-STAGE; CURE KINETICS; FLIP CHIP; UNDERFILLS; WAFER LEVEL;

EID: 2342464934     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856104773635472     Document Type: Article

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