Aerogel for microsystems thermal insulation: System design and process development

Proceedings of the ASME Summer Heat Transfer Conference

Volumn 4, Issue , 2005, Pages 753-762

  Smith, Brian ^a   Romero, David ^a   Agonafer, Damena ^a   Gu, Jason ^a   Amon, Cristina H ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AEROGEL FILMS; MICROSYSTEMS; PROCESS DEVELOPMENT; THERMAL MANAGEMENT DESIGNS;

AMORPHOUS MATERIALS; CHIP SCALE PACKAGES; CRYSTAL OSCILLATORS; INFRARED DEVICES; MICROELECTRONICS; PERMITTIVITY; POROSITY; PROCESS ENGINEERING; SENSORS; SILICON; SOL-GELS; SYSTEMS ANALYSIS; THERMAL CONDUCTIVITY; THERMAL INSULATION;

AEROGELS;

EID: 29644447709     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/HT2005-72663     Document Type: Conference Paper

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