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Volumn 14, Issue 1, 2003, Pages 26-30
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A manufacturable lead-free surface-mount process?
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Author keywords
[No Author keywords available]
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Indexed keywords
ACOUSTIC SPECTROSCOPY;
ELECTRONICS PACKAGING;
INTEGRATED CIRCUIT MANUFACTURE;
SOLDERED JOINTS;
SOLDERING ALLOYS;
X RAY ANALYSIS;
BALL GRID ARRAYS (BGA);
SURFACE MOUNT TECHNOLOGY;
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EID: 0037246222
PISSN: 10540407
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (5)
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References (0)
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