Investigation of thermal stability, phase formation, electrical, and microstructural properties of sputter-deposited titanium aluminide thin films

Thin Solid Films

Volumn 460, Issue 1-2, 2004, Pages 17-24

  Kim, H C ^a   Theodore, N D ^b   Gadre, K S ^a,c   Mayer, J W ^a   Alford, T L ^a  

^a Arizona State University   (United States)

^b MOTOROLA INC   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Characterization; Sputtering; Thermal stability; Titanium aluminide thin films

Indexed keywords

ELECTRIC PROPERTIES; MAGNETRON SPUTTERING; MICROSTRUCTURE; RUTHERFORD BACKSCATTERING SPECTROSCOPY; THERMODYNAMIC STABILITY; TITANIUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

COATING MATERIALS; FOUR-POINT PROBE MEASUREMENTS; TITANIUM ALUMINIDE THIN FILMS;

THIN FILMS;

EID: 2942597664     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.01.048     Document Type: Article

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