Removal of the metallorganic polymer residues formed at via holes

Journal of the Electrochemical Society

Volumn 151, Issue 5, 2004, Pages

  Song, Jongkook ^a   Kim, Jong Soo ^a   Seo, Hyungtak ^b   Kim, Yangdo ^c   Jeon, Hyeongtag ^b  

^a SAMSUNG Electronics   (South Korea)

^b Hanyang University   (South Korea)

^c Pusan National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CHEMICAL VAPOR DEPOSITION; CLEANING; ENERGY DISPERSIVE SPECTROSCOPY; HARDENING; PHOTOLITHOGRAPHY; REACTIVE ION ETCHING; REMOVAL; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICES; SPUTTERING; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRIC DEGRADATION; HOLES; METALLORGANIC POLYMER RESIDUES; POLYMER HARDENING;

METALLORGANIC POLYMERS;

EID: 2942567726     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1687430     Document Type: Article

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