Understanding of via-etch-induced polymer formation and its removal

Journal of the Electrochemical Society

Volumn 144, Issue 4, 1997, Pages 1522-1528

  Wang, Ying ^a,d   Graham, Sandra W ^b,c   Chan, Lap ^a   Loong, SheauTan ^a  

^a CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

^b Semitool Incorporated   (United States)

^c ELECTROCHEMICAL SOCIETY

^d MATTSON THERMAL PRODUCTS GMBH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING; ELECTRIC RESISTANCE; PHOTORESISTS; POLYMERIZATION; REACTIVE ION ETCHING;

CONTACT RESISTANCE; POLYMER FORMATION; POLYMER REMOVAL; VIA HOLES;

PLASMA ETCHING;

EID: 0031121486     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837621     Document Type: Article

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