Complete solvent free stripping of via structures using NF3/H2O/O2 ashing chemistry

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 4, 1999, Pages 1364-1368

  Au, Wing Kei ^a   Solis, Randy ^a   Bersin, Richard ^b   Xu, Han ^b   Boumerzoug, M ^b  

^a VLSI Technology Inc   (United States)

^b ULVAC Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0037957371     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581821     Document Type: Article

References (3)

1. R. L. Bersin, M. Boumerzoug, Q. Geng, I. Nakayama, and H. Xu, Semiconductor Fabtech, 6th ed., Spring, 1997.
2. R. L. Bersin, Application Specific Resist Stripping with Integrated Processing in a Single Multi-process Chamber, SPIE Symposium in Microelectronics Processing, Sept. 1992.
3. R. Solis et al., International Symposium on Semiconductor Manufacturing, Proceedings, F25, Oct. 1997.