Copper thin films on PET prepared at ambient temperature by ECR-CVD

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 781-784

  Ko, Hyungduk ^a   Jhin, Junggeun ^a   Byun, Dongjin ^a   Lee, Joongkee ^b   Park, Dalkeun ^b  

^a Korea University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

Cu(hfac)2; Electron cyclotron resonance chemical vapor deposition (ECR CVD); Plasma; Poly ethylene terephthalate (PET); Sheet resistance

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; ELECTRON CYCLOTRON RESONANCE; FILM PREPARATION; IONIZATION; METALLIZING; MORPHOLOGY; PLASMAS; POLYETHYLENE TEREPHTHALATES; TEMPERATURE; VOLATILE ORGANIC COMPOUNDS; X RAY DIFFRACTION ANALYSIS;

HOMOGENEOUS COMPOSITION; METALLIZED POLYMERS; SHEET RESISTANCE;

THIN FILMS;

EID: 29244468310     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.859670     Document Type: Review

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