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Volumn 125, Issue 2, 2006, Pages 519-525

Process window of micromachined gyroscopes subjected to vibrational frequencies

Author keywords

FEA; MEMS Gyroscope; Modal analysis; Process window

Indexed keywords

ANGLE MEASUREMENT; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MODAL ANALYSIS; ROBOTICS; VIBRATION CONTROL;

EID: 29144536154     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.08.021     Document Type: Article
Times cited : (15)

References (14)
  • 4
    • 0026881397 scopus 로고
    • A bulk silicon dissolved wafer process for microelectromechanical systems
    • Y. Ghandani, and K. Najafi A bulk silicon dissolved wafer process for microelectromechanical systems J. Microelectromech. Syst. 1992 77 85
    • (1992) J. Microelectromech. Syst. , pp. 77-85
    • Ghandani, Y.1    Najafi, K.2
  • 9
    • 0032138896 scopus 로고    scopus 로고
    • Micromachined inertial sensors
    • N. Yazdi, F. Ayazi, K. Najafi, Micromachined inertial sensors, Proc. IEEE, 86 (8) (1998) 1640-1659.
    • (1998) Proc. IEEE , vol.86 , Issue.8 , pp. 1640-1659
    • Yazdi, N.1    Ayazi, F.2    Najafi, K.3
  • 13
    • 3042699997 scopus 로고    scopus 로고
    • Fabrication, characterization, and analysis of a DRIE CMOS-MEMS gyroscope
    • H. Xie, G. Fedder, Fabrication, characterization, and analysis of a DRIE CMOS-MEMS gyroscope, IEEE Sens. J. 3 (2003) 622-631.
    • (2003) IEEE Sens. J. , vol.3 , pp. 622-631
    • Xie, H.1    Fedder, G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.