Impact of via-line contact on Cu interconnect electromigration performance

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2005, Pages 24-30

  Li, Baozhen ^a   Gill, Jason ^a   Christiansen, Cathryn J ^a   Sullivan, Timothy D ^a   McLaughlin, Paul S ^a  

^a IBM   (United States)

Author keywords

Cu interconnect; Electromigration; Line depletion; Line extension; Liner; Redundancy; Reliability; Ta; Void

Indexed keywords

CU INTERCONNECTS; LINE DEPLETION; LINE EXTENSION; LINER; VOIDS;

COPPER; DIFFUSION; ELECTRIC CONTACTS; ELECTRIC POWER SYSTEM INTERCONNECTION; INTERFACES (MATERIALS); REDUNDANCY; RELIABILITY;

ELECTROMIGRATION;

EID: 28744458389     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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