Gases evolved during cure and solder reflow of encapsulants and underfills

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1315-1320

  Cheung, A T ^a   Xu, Y ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ANALYSIS; CURING; DEGASSING; GAS CHROMATOGRAPHY; GASES; HIGH TEMPERATURE EFFECTS; MASS SPECTROMETRY; POLYMERS; SOLDERING;

ENCAPSULANTS; EVOLVED GAS ANALYSIS; SOLDER REFLOW; UNDERFILLS; VOLATILES;

ELECTRONICS PACKAGING;

EID: 0034835763     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Effect of volatiles from encapsulants on delamination
2. Outgassing, volatile organic content, and contamination content of materials used in today's electronics workplace
3. Application of Py-GCMS in electronic packaging industry for monitoring process and optimizing cure parameters
4. Recent development of GC capillary columns in Japan