Grain size effects in metallic thin films prepared using a new sputtering technology

Journal of Optoelectronics and Advanced Materials

Volumn 7, Issue 5, 2005, Pages 2713-2720

  Vopsaroiu, M ^a   Thwaites, M J ^b   Fernandez, G V ^a   Lepadatu, S ^a   O'Grady, K ^a  

^a UNIVERSITY OF YORK   (United Kingdom)

^b Plasma Quest Limited   (United Kingdom)

Author keywords

CoFe thin films; Grain size control; HiTUS plasma sputtering

Indexed keywords

BIAS VOLTAGE; BINARY ALLOYS; COBALT ALLOYS; COBALT METALLOGRAPHY; GLOW DISCHARGES; GRAIN SIZE AND SHAPE; IRON ALLOYS; IRON METALLOGRAPHY; SPUTTERING; URANIUM METALLOGRAPHY;

EXCHANGE-BIAS FIELDS; GRAIN SIZE ANALYSIS; GRAIN SIZE CONTROL; MEAN GRAIN DIAMETER; METALLIC THIN FILMS; PLASMA SPUTTERING; SPUTTERING CHAMBER; SPUTTERING TECHNOLOGY;

THIN FILMS;

EID: 27844440807     PISSN: 14544164     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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