Response of 60Sn-40Pb under thermal and mechanical cycling

ASTM Special Technical Publication

Volumn , Issue 1371, 2000, Pages 85-102

  Woodmansee, Michael W ^b   Neu, Richard W ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FATIGUE OF MATERIALS; MICROSCOPIC EXAMINATION; PYROLYSIS; SURFACE ROUGHNESS; THERMAL CYCLING; THERMAL EXPANSION;

CONFOCAL SCANNING LASER MICROSCOPE; MECHANICAL CYCLING; THERMOMECHANICAL FATIGUE;

SOLDERING ALLOYS;

EID: 0033878732     PISSN: 10403094     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1520/stp15255s     Document Type: Conference Paper

References (13)

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9. Ross, R. G. and Wen L.-C., "Solder Creep-Fatigue Interactions with Flexible Leaded Surface Mount Components," Thermal Stress and Strain in Microelectronics Packaging, J. H. Lau, Ed., Van Nostrand Reinhold, 1993, pp. 607-647.
10. Scott, D. T., "Phenomenological Modeling of the Deformation Behavior of Solders," Master's Thesis, Georgia Institute of Technology, 1998.
11. Woodmansee, M. W., "Thermal Cycling and Rate-Dependent Stress Relaxation Behavior of Solders," Master's Thesis, Georgia Institute of Technology, 1999.
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