A fast and flexible thermal simulation tool validated on smart power devices

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn , Issue , 2005, Pages 111-114

  Desoete, B ^a   Moens, P ^a   Driessens, E ^b   Elattari, B ^b   Van Den Bosch, G ^b   Gillon, R ^a   Groeseneken, G ^b  

^a ON SEMICONDUCTOR   (United States)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; FUNCTIONS; NUMERICAL METHODS; TEMPERATURE DISTRIBUTION; THERMOANALYSIS;

CIRCUIT DESIGN; NUMERICAL SOFTWARE; THERMAL SIMULATION;

INTELLIGENT MATERIALS;

EID: 27744567843     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. P. Hower, GY. Tsai, S. Merchant, T. Efland, S. Pendharkar, R. Steinhoff, and J. Brodsky, "Avalanche-induced Thermal Instability in Ldmos Transistors," in Proc. of the ISPSD Symposium, 2001, pp. 153-156.
2. V. Khemka, V. Parthasarathy, R. Zhu, A. Bose, and T. Roggenbauer, "Detection and Optimization of Temperature Distribution Across Large-Area Power MOSFETs to Improve Energy Capability," IEEE Trans. on Electron Devices, vol. 51, no. 6, pp. 1025-1032, June 2004.
3. M. Denison, M. Pfost, K.-W. Pieper, S. Märkl, D. Metzner, and M. Stecher, "Influence of Inhomogeneous Current Distribution on the Thermal SOA of Integrated DMOS Transistors," in Proc. of the ISPSD Symposium, 2004, pp. 409-412.
4. R. C. Joy and E. S. Schlig, "Thermal Properties of Very Fast Transistors," IEEE Trans. on Electron Devices, vol. ED-17, pp. 586-594, Aug. 1970.
5. N. Rinaldi, "On the Modeling of the Transient Thermal Behavior of Semiconductor Devices," IEEE Trans. on Electron Devices, vol. 48, no. 12, pp. 2796-2802, Dec. 2001.
6. N. Rinaldi, "Generalized Image Method With Application to the Thermal Modeling of Power Devices and Circuits," IEEE Trans. on Electron Devices, vol. 49, no. 4, pp. 679-686, April 2002.
7. V. Kadambi and N. Abuaf, "An Analysis of Thermal Response of Power Chip Packages,"IEEE Trans. on Electron Devices, vol. ED-32, pp. 1024-1033, 1985.
8. W. Batty, C. E. Christoffersen, A. J. Panks, S. David C. M. Snowden, and M. B. Steer, "Electrothermal CAD of Power Devices and Circuits with Fully Physical Time-Dependent Compact Thermal Modeling of Complex Nonlinear 3-D Systems," IEEE Trans. on Components and Packaging Technologies, vol. 24, no. 4, pp. 566-590, Dec. 2001.
9. C. Anghel, A.M. Ionescu, N. Hefyene, and R. Gillon, "Self-Heating Characterization and Extraction Method for Thermal Resistance and Capacitance in High Voltage MOSFETs," in Proc. of the ESSDERC Conference, 2003, pp. 449-452.
10. G. Van den bosch, P. Moens, P. Gassot, D. Wojciechowski, and G. Groeseneken, "Analysis and Application of Energy Capability Characterization Methods in Power MOSFETs," in Proc. of the ESSDERC Conference, 2004, pp. 453-456.