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Volumn 10, Issue 3, 2001, Pages 400-408
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Fabrication of air-channel structures for microfluidic, microelectromechanical, and microelectronic applications
a
IEEE
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
AIR CHANNEL STRUCTURES;
MICROELECTRONIC APPLICATIONS;
MICROFLUIDIC;
POLYNORBORNENE;
COPPER;
DIELECTRIC MATERIALS;
ELECTROPLATING;
ENCAPSULATION;
ETCHING;
HIGH TEMPERATURE OPERATIONS;
LITHOGRAPHY;
MICROELECTROMECHANICAL DEVICES;
ORGANIC POLYMERS;
PLASTIC FILMS;
MICROELECTRONIC PROCESSING;
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EID: 0035441452
PISSN: 10577157
EISSN: None
Source Type: Journal
DOI: 10.1109/84.946793 Document Type: Article |
Times cited : (94)
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References (11)
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