Flexible stamp for nanoimprint lithography

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2005, Pages 508-511

  Nielsen, T ^a   Pedersen, R H ^a   Hansen, O ^a   Haatainen, T ^b   Tolkki, A ^b   Ahopelto, J ^b   Kristensen, A ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STIFFNESS; NANOIMPRINT LITHOGRAPHY (NIL); SILICON STAMP; WAFER QUALITY;

BENDING (DEFORMATION); DEFORMATION; LITHOGRAPHY; MICROMACHINING; SILICON; SILICON WAFERS; STIFFNESS;

STAMPING;

EID: 26844499172     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2005.1453978     Document Type: Conference Paper

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