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Volumn 338, Issue 1-2, 1992, Pages 155-165

The chemistry of the additives in an acid copper electroplating bath. Part I. Polyethylene glycol and chloride ion

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EID: 18344382063     PISSN: 00220728     EISSN: None     Source Type: Journal    
DOI: 10.1016/0022-0728(92)80420-9     Document Type: Article
Times cited : (248)

References (12)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.