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Volumn 338, Issue 1-2, 1992, Pages 155-165
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The chemistry of the additives in an acid copper electroplating bath. Part I. Polyethylene glycol and chloride ion
a a b |
Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 18344382063
PISSN: 00220728
EISSN: None
Source Type: Journal
DOI: 10.1016/0022-0728(92)80420-9 Document Type: Article |
Times cited : (248)
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References (12)
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