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Volumn 56, Issue 3, 2000, Pages 255-268

Effect of copper, acid, and temperature on the diffusion coefficient of cupric ions in simulated electrorefining electrolytes

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER METALLURGY; CURRENT DENSITY; ELECTROLYTES; FINITE DIFFERENCE METHOD; IONS; MATHEMATICAL MODELS; METAL REFINING;

EID: 0033689773     PISSN: 0304386X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0304-386X(00)00070-0     Document Type: Article
Times cited : (80)

References (16)
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  • 2
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  • 4
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    • Toward a reliable value for the diffusion coefficient of cupric ion in aqueous solution
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    • Quickenden, T.I.1    Xu, Q.2
  • 5
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  • 6
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    • Schleon, J.M.1    Davenport, W.G.2
  • 7
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    • Cheng X., Hiskey J.B. Fundamental studies of copper anode passivation during electrorefining: Part I. Development of techniques. Metallurgical Transactions B. 27B:1996;393-398.
    • (1996) Metallurgical Transactions B , vol.27 , pp. 393-398
    • Cheng, X.1    Hiskey, J.B.2
  • 9
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.