Electrically conductive adhesive and soldered joints under compression

Journal of Adhesion Science and Technology

Volumn 19, Issue 11, 2005, Pages 1003-1023

  Kim, Kyu Dong ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Adhesive; Electrical resistivity; Epoxy; Joint; Silver; Solder

Indexed keywords

ADHESIVES; COMPACTION; COMPRESSIVE STRESS; ELECTRIC CONDUCTIVITY; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; STRESS ANALYSIS;

ELECTRICAL RESISTIVITY; EPOXY; STRESS AMPLITUDE; STRESS CYCLING;

ADHESIVE JOINTS;

CONDUCTIVE ADHESIVE; ELECTRICAL RESISTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVES; EPOXY; HIGH STRESS; INTERMEDIATE STRESS; JOINT; LOW STRESS; NO LOAD; SOLDER; STRESS AMPLITUDES; STRESS CYCLING;

EID: 25444493123     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/1568561054950988     Document Type: Article

References (19)

1. R. R. Gomatam and E. Sancaktar, J. Adhesion Sci. Technol. 18, 1225-1243 (2004).
2. R. R. Gomatam and E. Sancaktar, J. Adhesion Sci. Technol. 18, 1245-1261 (2004).
3. E. Sancaktar and N. Dilsiz, J. Adhesion Sci. Technol. 13, 763-771 (1999).
4. E. Sancaktar and Y. Wei, J. Adhesion Sci. Technol. 10, 1221-1235 (1996).
5. K. Feldmann and R. Luchs, Surface Mount Technol. 12, 74-78 (1998).
6. T. W. Giants, J. Adhesion Sci. Technol. 12, 593-613 (1998).
7. T. Inada and C. P. Wong, in: Proceedings of the 4th IMAPS International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, pp. 268-271 (1998).
8. S. K. Kang and S. Purushothaman, J. Electron. Mater. 28, 1314-1318 (1999).
9. D. Lu, Q. K. Tong and C. P. Wong, IEEE Transactions on Electronics Packaging Manufacturing 22, 228-232 (1999).
10. C. P. Wong, D. Lu, L. Meyers, S. Vona, Jr. and K. Tong, in: Proceedings of the 1st IEEE International Symposium on Polymeric Electronics Packaging, PEP (1997), pp. 80-85. IEEE, Piscataway, NJ (1997).
11. M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, T. Hanlon, P. Arrowsmith, A. Chaudhuri, R. Hermansen, S. Lau and D. Napp, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part C 19, 241-250 (1996).
12. X. Luo and D. D. L. Chung, J. Mater. Sci. 34, 273-276 (1999).
13. J. Seyyedi and S. Jawaid, Soldering Surface Mount Technol. 4, 44-49 (1990).
14. K. D. Kim and D. D. L. Chung, J. Electron. Mater. 31, 933-939 (2002).
15. T. Goswami, Int. J. Fatigue 21, 55-76 (1999).
16. M. Cole and T. Caulfield, Scripta Metall. Mater. 27, 903-908 (1992).
17. U. Genz, J. A. Helsen and J. Mewis, J. Colloid Interface Sci. 165, 212-220 (1994).
18. C. Ishii, K. Koseki, T. Amari, Y. Hanzawa, N. Yoshizawa, H. Hatori, Y. Yamada and S. Yamazaki, Carbon 39, 2384-2386 (2001).
19. J. Mewis, L. M. de Groot and J. A. Helsen, Colloid. Surf. 22, 271-289 (1987).