A comparative study of silver-epoxy and tin-lead solder in their joints with copper, through mechanical and electrical measurements during debonding

Journal of Materials Science

Volumn 34, Issue 2, 1999, Pages 273-276

  Luo, X ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING; COPPER; DUCTILITY; ELECTRIC CONDUCTIVITY OF SOLIDS; SOLDERED JOINTS; SURFACE TREATMENT;

ACETONE WASHING; SHEAR DEBONDING; SILVER-EPOXY SOLDER; TIN-LEAD SOLDER;

SOLDERING ALLOYS;

EID: 0032652837     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004445320025     Document Type: Article

References (7)

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