Grain growth mechanism of Cu thin films

Materials Transactions

Volumn 46, Issue 7, 2005, Pages 1737-1740

  Murakami, Masanori ^a   Moriyama, Miki ^b   Tsukimoto, Susumu ^a   Ito, Kazuhiro ^a  

^a KYOTO UNIVERSITY   (Japan)

^b Toyoda Gosei Co Ltd   (Japan)

Author keywords

Copper thin film; Grain growth; Strain energy

Indexed keywords

COPPER; ELECTRIC RESISTANCE; GRAIN GROWTH; SILICON; STRAIN RATE; ULSI CIRCUITS;

COPPER THIN FILMS; ELECTRICAL PROPERTIES; GRAIN SIZES; STRAIN ENERGY;

THIN FILMS;

EID: 24944468144     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.1737     Document Type: Article

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