The design of miniature 3D RF module

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 814-817

  Lähteenmäki, Jussi ^a   Miettinen, Jani ^a   Heino, Pekka ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

MICROPROCESSOR CHIPS; MULTILAYERS; SEMICONDUCTOR MATERIALS; SOLDERING ALLOYS; SUBSTRATES; TESTING;

ELECTRICAL DESIGN; SEMICONDUCTOR TECHNOLOGIES; SYSTEM IN PACKAGE;

LOGIC DESIGN;

EID: 24644519507     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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