RF SiP: The next wave for wireless system integration

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 2004, Pages 233-236

  Smolders, A Bart ^a   Pulsford, Nick J ^a   Philippe, Pascal ^a   Van Straten, Freek E ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

Packaging Technology; Passive Integration; System in Package (SiP); System on Chip (SoC); Wireless Connectivity

Indexed keywords

PACKAGING TECHNOLOGY; PASSIVE INTEGRATION; SYSTEM-IN-PACKAGE (SIP); SYSTEM-ON-CHIP (SOC); WIRELESS CONNECTIVITY;

BANDPASS FILTERS; CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; LEAKAGE CURRENTS; MAGNETOELECTRIC EFFECTS; NATURAL FREQUENCIES; NUMERICAL METHODS; SEMICONDUCTING SILICON; SEMICONDUCTOR DIODES; THIN FILMS;

WIRELESS TELECOMMUNICATION SYSTEMS;

EID: 4444289126     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Matsuzawa, A., "RF-SoC: Expectations and required conditions" IEEE Trans. Microwave Theory & Tech., vol. 50, no. 1, pp. 245-253, January 2002.
2. Tai, K.L., "System-in-Package (SiP): Challenges and Opportunities" Proceedings of the ASP-DAC 2000, pp. 191-196, January 2000.
3. Pulsford, N.J., "Passive Integration technology: Targeting small accurate RF parts" RF Design, pp. 40-48, November 2002.
4. th European Conference on wireless technologies, Munich, pp. 221-225, October 2003.