RF SiP technology innovation through integration

ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings

Volumn , Issue , 2003, Pages 484-490

  Wu, Jianhua ^a   Anderson, M J ^a   Coller, D ^a   Guth, G ^a  

^a Anadigics Inc   (United States)

Author keywords

Costs; Integrated circuit packaging; Logic; Radio frequency; Radiofrequency integrated circuits; Surface mount technology; System on a chip; Technological innovation; Telephone sets; Wireless communication

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CHIP SCALE PACKAGES; COSTS; ECONOMIC AND SOCIAL EFFECTS; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; LOGIC CIRCUITS; MICROPROCESSOR CHIPS; PACKAGING; PROGRAMMABLE LOGIC CONTROLLERS; RADIO TELEPHONE; SURFACE MOUNT TECHNOLOGY; SYSTEM-ON-CHIP; TELEPHONE SETS; WIRELESS NETWORKS; WIRELESS TELECOMMUNICATION SYSTEMS;

INTEGRATED CIRCUIT PACKAGING; LOGIC; RADIO FREQUENCIES; RADIO FREQUENCY INTEGRATED CIRCUITS; SYSTEM ON A CHIP; TECHNOLOGICAL INNOVATION; WIRELESS COMMUNICATIONS;

SYSTEM-IN-PACKAGE;

EID: 84946415738     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1298786     Document Type: Conference Paper

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