Flexible electronic-optical local bus modules to the board-to-board, board-to-chip, and chip-to-chip optical interconnection

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 1039-1043

  Shen, Li Cheng ^a   Lo, Wei Chung ^a   Chang, Hsiang Hung ^a   Fu, Huan Chun ^a   Lee, Yuan Chang ^a   Chang, Shu Ming ^a   Chen, Yu Chih ^a   Chen, Wun Yan ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

LIGHT TRANSMISSION; MICROPROCESSOR CHIPS; OPTICAL WAVEGUIDES; PRINTED CIRCUIT BOARDS; SIGNAL PROCESSING;

BUS MODULES; ELECTRICAL INTERFACES; OPTICAL SIGNALS;

OPTICAL INTERCONNECTS;

EID: 24644508484     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Mederer, F. et al, "3-Gb/s Data transmission With GaAs VCSELs over PCB Integrated Polymer Waveguides," IEEE Photonics Technology Letters, Vol. 12, No. 9 (2001), pp. 1032-1034.
2. Mohammed, E. et al, "Optical interconnection system integration for ultra-short-reach applications," Intel Technology Journal, Vol. 87, No. 2 (2004), pp. 115-128.
3. Mohammed, E. et al, "Optical I/O technology for digital VLSI," Proc of the SPIE, San Jose, CA, June, 2004, Vol. 5358, pp. 60-70.
4. th Electronic Components and Technology Conf, New Orleans, LA, May, 2003, pp. 1067-1072.
5. Ishii, Y. et al, "SMT-Compatible Large-Tolerance "OptoBump" Interface for Interchip Optical Interconnection," IEEE Trans. Advanced Packaging, Vol. 26, No. 2 (2003), pp. 122-127.
6. th Electronic Components and Technology Conf, New Orleans, LA, May, 2003, pp. 1053-1059.
7. th Electronic Components and Technology Conf, Las Vegas, NV, June, 2004, pp. 1947-1951.
8. th Electronic Components and Technology Conf, New Orleans, LA, May, 2003, pp. 1140-1146.
9. Optical Backplanes-A Global Market and Technology Review 2000-2005, Report number 762, BPA consulting Ltd.
10. Liu, A "A High-Speed Silicon Optical Modulator Based on a Metal-oxide-semiconductor Capacitor," Nature, Feb. 22,2004, pp. 615-618.
11. th Electronics Packaging Technology Conf, Singapore, Dec., 2004.