Characterization of organic multi-mode optical waveguides for the Electro-Optical Printed Circuit Board (EOPCB)

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 753-758

  Shen, Li Cheng ^a   Lo, Wei Chung ^a   Chang, Hsiang Hung ^a   Fu, Huan Chun ^a   Lee, Yuan Chang ^a   Chen, Yu Chih ^a   Chang, Shu Ming ^a   Chen, Wun Yan ^a   Chou, Ming Chieh ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

LIGHT PROPAGATION; LIGHT SOURCES; RELIABILITY; THERMAL EFFECTS;

OPTICAL LOSS; OPTICAL POWER DISTRIBUTION; ORGANIC ARRAY WAVEGUIDES; VERTICAL CAVITY SURFACE EMITTING LAASERS (VCSEL);

OPTICAL WAVEGUIDES;

EID: 28444484687     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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3. Ishii, Y. et al, "SMT-Compatible Large-Tolerance "OptoBump" Interface for Interchip Optical Interconnection," IEEE Trans. Advanced Packaging, Vol. 26, No. 2 (2003), pp. 122-127.
4. Mederer, F. et al, "3-Gb/s Data transmission With GaAs VCSELs over PCB Integrated Polymer Waveguides," IEEE Photonics Technology Letters, Vol. 12, No. 9 (2001), pp. 1032-1034.
5. th Electronic Components and Technology Conf, New Orleans, LA, May, 2003, pp. 1053-1059.
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