Optical I/O technology for digital VLSI

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5358, Issue , 2004, Pages 60-70

  Mohammed, E M ^a   Thomas, T P ^a   Lu, D ^a   Braunisch, H ^a   Towle, S ^a   Barnett, B C ^a   Young, I A ^a   Vandentop, G ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Flip chip; Hybrid packaging; Optical I O; Photodetector arrays; Polymer waveguides; VCSEL arrays

Indexed keywords

FLIP-CHIP; HYBRID PACKAGING; OPTICAL I/O; PHOTODETECTOR ARRAYS; POLYMER WAVEGUIDES; VCSEL ARRAYS;

ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; LASER BEAM EFFECTS; MICROPROCESSOR CHIPS; OPTICAL SYSTEMS; TRANSMITTERS; VLSI CIRCUITS;

OPTICAL LINKS;

EID: 3543071670     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.530160     Document Type: Conference Paper

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