Critical dimension sensitivity to post-exposure bake temperature variation in EUV photoresists

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5751, Issue II, 2005, Pages 1092-1100

  Cain, Jason P ^a,c   Naulleau, Patrick ^b   Spanos, Costas J ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c ADVANCED MICRO DEVICES   (United States)

Author keywords

Extreme ultraviolet (EUV) lithography; Micro exposure tool (MET) optic; Photoresist; Post exposure bake (PEB); Synchrotron

Indexed keywords

CRITICAL DIMENSION (CD) SENSITIVITY; EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY; MICRO-EXPOSURE TOOL (MET) OPTIC; POST-EXPOSURE BAKE (PEB);

LITHOGRAPHY; POLYIMIDES; SENSITIVITY ANALYSIS; SENSORS; SYNCHROTRONS; THERMAL EFFECTS; THIN FILMS; ULTRAVIOLET RADIATION;

PHOTORESISTS;

EID: 24644494195     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.600432     Document Type: Conference Paper

References (7)

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