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Volumn 5375, Issue PART 1, 2004, Pages 703-712

Time-based PEB adjustment for optimizing CD distributions

Author keywords

Critical dimension variation; Lithography process control; Photolithography; Post exposure bake

Indexed keywords

CRITICAL DIMENSION VARIATION; LITHOGRAPHY PROCESS CONTROL; POST EXPOSURE BAKE; THERMAL MASS;

EID: 4344617169     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.535871     Document Type: Conference Paper
Times cited : (18)

References (5)
  • 2
    • 0036029660 scopus 로고    scopus 로고
    • Characterizing post-exposure bake processing for transient and steady-state conditions, in the context of critical dimension control
    • Metrology, Inspection, and Process Control for Microlithography XVI, D. Herr, ed
    • D. A. Steele, A. Coniglio, C. Tang, B. Singh, C. Spanos, S. Nip, "Characterizing post-exposure bake processing for transient and steady-state conditions, in the context of critical dimension control," in Metrology, Inspection, and Process Control for Microlithography XVI, D. Herr, ed., Proc. SPIE 4689, pp. 517-530, 2002.
    • (2002) Proc. SPIE , vol.4689 , pp. 517-530
    • Steele, D.A.1    Coniglio, A.2    Tang, C.3    Singh, B.4    Spanos, C.5    Nip, S.6
  • 3
    • 0033690830 scopus 로고    scopus 로고
    • Temperature rising effect of 193nm chemically amplified resist during post exposure bake
    • Advances in Resist Technology and Processing XVII, F. Houlihan, ed.
    • Y. Lee, M. Sung, E. Lee, Y. Sohn, H. Bak, H. Oh, "Temperature Rising Effect of 193nm Chemically Amplified Resist during Post Exposure Bake," in Advances in Resist Technology and Processing XVII, F. Houlihan, ed., Proc. SPIE 3999, pp. 1000-1008, 2000.
    • (2000) Proc. SPIE , vol.3999 , pp. 1000-1008
    • Lee, Y.1    Sung, M.2    Lee, E.3    Sohn, Y.4    Bak, H.5    Oh, H.6
  • 4
    • 0034761538 scopus 로고    scopus 로고
    • Modeling the impact of thermal history during post exposure bake on the lithographic performance of chemically amplified resists
    • Advances in Resist Technology and Processing XVIII, F. Houlihan, ed.
    • M. D. Smith, C. A. Mack, J. S. Petersen, "Modeling the impact of thermal history during post exposure bake on the lithographic performance of chemically amplified resists," in Advances in Resist Technology and Processing XVIII, F. Houlihan, ed., Proc. SPIE 4345, pp. 1013-1021, 2001.
    • (2001) Proc. SPIE , vol.4345 , pp. 1013-1021
    • Smith, M.D.1    Mack, C.A.2    Petersen, J.S.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.