Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 727-732

  Manessis, Dionysios ^a   Patzelt, Rainer ^a   Nieland, Sabine ^a   Ostmann, Andreas ^b   Aschenbrenner, Rolf ^b   Reichl, Herbert ^b  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Flip chip bumping; Solder bump height; Stencil printing; Type 7 solder paste

Indexed keywords

ELECTROPLATING; EVAPORATION; FLIP CHIP DEVICES; PRINTING; RELIABILITY; SOLDERING;

RECTANGULAR PADS; STENCIL PRINTING; ULTRA FINE PITCH FLIP CHIP BUMPING;

MICROELECTRONIC PROCESSING;

EID: 0036448312     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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