A leadless packaging concept for high frequency applications

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1851-1854

  Theuss, H ^a   Dangelmaier, J ^a   Engl, M ^a   Pressel, K ^a   Knapp, H ^a   Simburger W ^a   Gnannt, K ^a   Eurskens, W ^a   Hirtreiter, J ^a   Weigel, R ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BIPOLAR TRANSISTORS; ELECTRIC POWER SYSTEM INTERCONNECTION; FREQUENCY DIVIDING CIRCUITS; GLOBAL SYSTEM FOR MOBILE COMMUNICATIONS; MICROPROCESSOR CHIPS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; TRANSCEIVERS; WIRELESS TELECOMMUNICATION SYSTEMS;

ELECTRICAL PERFORMANCE; FLIP CHIP VERSION; FREQUENCY DIVIDERS; MINIATURIZATION;

ELECTRONICS PACKAGING;

EID: 10444268866     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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11. M. Engl, K. Pressel, J. Dangelmaier, H. Theuss, W. Eurskens, H. Knapp, W. Simbürger, and R. Weigel, "A Flip-Chip Mounted 29 GHz Frequency Divider in a Novel Small Leadless Plastic Package, to be published at the "International Microwave Symposium", Fort Worth, June 2004