The effects of Cu doping in eutectic PbSn solder balls on ENIG substrates

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 922-926

  Nguyen, My ^a  

^a ALTERA CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DOPANTS; SOLDER BALLS; TEST VEHICLES;

COPPER; DOPING (ADDITIVES); INTERMETALLICS; NICKEL; SUBSTRATES; TESTING;

SOLDERED JOINTS;

EID: 24644469190     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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