Effect of iron plating conditions on reaction in molten lead-free solder

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 741-746

  Nishikawa, Hiroshi ^a   Takemoto, Tadashi ^a   Kifune, Kouichi ^b   Uetani, Takashi ^c   Sekimori, Norihisa ^c  

^a OSAKA UNIVERSITY   (Japan)

^b Osaka Prefecture University   (Japan)

^c Hakko Corporation   (Japan)

Author keywords

Dissolution; Grain size; Interfacial reaction; Lead free solder; Plated iron; Soldering iron tip

Indexed keywords

ACTIVATION ENERGY; CURRENT DENSITY; DISSOLUTION; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; GRAIN SIZE AND SHAPE; INTERMETALLICS; IRON PLATING; SCANNING ELECTRON MICROSCOPY; SOLDERING; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

INTERFACIAL REACTION; LEAD-FREE SOLDERS; PLATED IRON; SOLDERING IRON TIP;

SOLDERING ALLOYS;

EID: 2442604462     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.741     Document Type: Article

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