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Volumn 206, Issue 1-4, 2003, Pages 355-364

Removal efficiency of organic contaminants on Si wafer by dry cleaning using UV/O 3 and ECR plasma

Author keywords

AFM; ATR FTIR; Dry cleaning; ECR plasma; Organic contaminants; UV O 3

Indexed keywords

ATOMIC FORCE MICROSCOPY; DRY CLEANING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; SURFACE ROUGHNESS;

EID: 0037441189     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(02)01215-1     Document Type: Note
Times cited : (62)

References (23)
  • 3
    • 0012859944 scopus 로고
    • In semiconductor wafer bonding: Science technology, and applications/1002
    • in: U. Gosele, T. Abe, J. Haisma, M.A. Schmidt (Eds.), Pennington, NJ
    • K.J. Budde, W.J. Holzapfel, in Semiconductor Wafer Bonding: Science Technology, and Applications/1002, in: U. Gosele, T. Abe, J. Haisma, M.A. Schmidt (Eds.), Proceedings of the Electrochemical Society Series on PV 92-7, Pennington, NJ, 1992, p. 271.
    • (1992) Proceedings of the Electrochemical Society Series on PV 92-7 , pp. 271
    • Budde, K.J.1    Holzapfel, W.J.2
  • 13
    • 0042493356 scopus 로고    scopus 로고
    • Taro ichihara and kohei uosaki
    • Ye S. Taro Ichihara and Kohei Uosaki. Appl. Phys. Lett. 75:1999;1562.
    • (1999) Appl. Phys. Lett. , vol.75 , pp. 1562
    • Ye, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.