Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages

Journal of Electronic Materials

Volumn 32, Issue 6, 2003, Pages 574-582

  Lebbai, M ^a,b   Kim, Jang Kyo ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b QPL Ltd   (Hong Kong)

Author keywords

Hygrothermal aging; Interfacial adhesion; Lead frame; Metal coatings; Moisture sensitivity; Plastic packages

Indexed keywords

ADHESION; AGING OF MATERIALS; COMPOSITION EFFECTS; HEAT TREATMENT; INFRARED SPECTROSCOPY; INTERFACES (MATERIALS); MOISTURE; PACKAGING MATERIALS; RELIABILITY; THERMAL EFFECTS;

HYGROTHERMAL AGING; INFRARED SOLDER REFLOW CONDITION; INTERFACIAL ADHESION; MOISTURE SENSITIVITY; PLASTIC PACKAGES;

PLASTICS APPLICATIONS;

EID: 0037821879     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0144-9     Document Type: Article

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