Numerical simulation of laser/IR assisted micro-embossing

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 1, Issue , 2004, Pages 1200-1204

  Lu, Chunmeng ^a   Juang, Yi Je ^a   Lee, L James ^a   Grewell, David ^b   Benatar, Avraham ^b  

^a Ohio State University   (United States)

^b OHIO STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY FLUX; HOT EMBOSSING; INFRARED ASSEMBLY METHOD (IRAM); RADIATION ENERGY;

COMPUTER SIMULATION; COOLING; FINITE ELEMENT METHOD; FLOW PATTERNS; GLASS TRANSITION; HEAT TRANSFER; HIGH DENSITY POLYETHYLENES; INFRARED HEATING; INFRARED RADIATION; INJECTION MOLDING; LITHOGRAPHY; PLASTIC FLOW; POLYMERS; STRAIN RATE; THERMAL EXPANSION;

SYSTEMS ENGINEERING;

EID: 2442456481     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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4. S. Y. Chou, C.Keimel and J. Gu, Ultrafast and direct imprint of nanostructures in silicon, Nature, 417, 20 June (2002).
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6. S. Hillmansen, S. Hobeika, R. N. Haward, and P. S. Leevers, The effect of strain rate, temperature, and molecular mass on the tensile deformation of polyethylene, Polymer Engineering and Science, 40(2), 481 (2000).