Experimental study on organic solderability preservative

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 56-61

  Li, Yuan ^a  

^a Exabyte Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PRINTED CIRCUIT BOARDS; SOLDERING;

ORGANIC SOLDERABILITY PRESERVATIVES (OSP);

SURFACE MOUNT TECHNOLOGY;

EID: 0031373160     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)