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Volumn 14, Issue 8, 2000, Pages
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PCB fabrication: Achieving solderable finishes
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Author keywords
[No Author keywords available]
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Indexed keywords
GOLD;
MASKS;
NICKEL;
PRINTED CIRCUIT BOARDS;
SOLDERING;
HOT AIR SOLDER LEVELING (HASL);
ORGANIC SOLDERABILITY PRESERVATIVES (OSP);
QUAD FLAT PACKS (QFP);
SOLDERMASKS;
PRINTED CIRCUIT MANUFACTURE;
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EID: 0034245881
PISSN: 08933588
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (3)
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References (0)
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