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Materials Transactions

Volumn 45, Issue 3, 2004, Pages 747-753

Influence of noble metal coating on wettability of copper substrate by Sn-Ag eutectic solder

(2) Takao, Hisaaki a Hasegawa, Hideo a

a Rd Management Section (Japan)

Author keywords

Coating; Contact angle; Interfacial tension; Lead free solder; Meniscograph method; Noble metal; Wettability

Indexed keywords

CAMERAS; CHARGE COUPLED DEVICES; CONTACT ANGLE; COPPER; ENVIRONMENTAL PROTECTION; PRECIOUS METALS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING; SURFACE TENSION; TIN COMPOUNDS; WETTING;

COATING; LEAD FREE SOLDER; MENISCOGRAPH; NOBLE METAL; WETTABILITY;

METALS;

EID: 2442480599 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.45.747 Document Type: Article

Times cited : (8)

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