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Volumn E88-C, Issue 5, 2005, Pages 788-794

Design guidelines and process quality improvement for treatment of device variations in an LSI chip

Author keywords

Correlation length; Fitting function; Random variation; Systematic variation; Within die parameter variation

Indexed keywords

ELECTRIC RESISTANCE; LEAST SQUARES APPROXIMATIONS; MICROPROCESSOR CHIPS; POLYNOMIALS; POLYSILICON; QUALITY CONTROL; RANDOM PROCESSES; TRANSISTORS;

EID: 24144464519     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: 10.1093/ietele/e88-c.5.788     Document Type: Conference Paper
Times cited : (12)

References (8)
  • 3
    • 0037966389 scopus 로고    scopus 로고
    • Analysis and characterization of device variations in an LSI chip using an integrated Device Matrix Array
    • March
    • S. Ohkawa, M. Aoki, and H. Masuda, "Analysis and characterization of device variations in an LSI chip using an integrated Device Matrix Array," Proc. ICMTS, pp.70-75, March 2003.
    • (2003) Proc. ICMTS , pp. 70-75
    • Ohkawa, S.1    Aoki, M.2    Masuda, H.3
  • 5
    • 0028571338 scopus 로고
    • Implication of fundamental threshold voltage variations for high-density SRAM and logic circuits
    • June
    • D. Burnett, K. Erington, C. Subramanian, and K. Baker, "Implication of fundamental threshold voltage variations for high-density SRAM and logic circuits," Symp. VLSI Technology, Technical Digest, pp.15-16, June 1994.
    • (1994) Symp. VLSI Technology, Technical Digest , pp. 15-16
    • Burnett, D.1    Erington, K.2    Subramanian, C.3    Baker, K.4
  • 7
    • 0030682962 scopus 로고    scopus 로고
    • An on-chip, interconnect capacitance characterization method with sub-femto-farad resolution
    • March
    • J.C. Chen, D. Sylvester, C. Hu, H. Aoki, S. Nakagawa, and S.-Y. Oh, "An on-chip, interconnect capacitance characterization method with sub-femto-farad resolution," Proc. ICMTS, pp.77-80, March 1997.
    • (1997) Proc. ICMTS , pp. 77-80
    • Chen, J.C.1    Sylvester, D.2    Hu, C.3    Aoki, H.4    Nakagawa, S.5    Oh, S.-Y.6
  • 8
    • 0031077147 scopus 로고    scopus 로고
    • Analysis and decomposition of spatial variation in integrated circuit processes and devices
    • Feb.
    • B.E. Stine, D.S. Boning, and J.E. Chung, "Analysis and decomposition of spatial variation in integrated circuit processes and devices," IEEE Trans. Semicond. Manuf., vol.10, no.1, pp.24-41, Feb. 1997.
    • (1997) IEEE Trans. Semicond. Manuf. , vol.10 , Issue.1 , pp. 24-41
    • Stine, B.E.1    Boning, D.S.2    Chung, J.E.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.