Characterization of cathodic arc deposited titanium aluminium nitride films prepared using plasma immersion ion implantation

Journal of Physics Condensed Matter

Volumn 17, Issue 17, 2005, Pages 2791-2800

  Lim, S H N ^a   McCulloch, D G ^a   Bilek, M M M ^b   McKenzie, D R ^b   Russo, S P ^a   Barnard, A S ^c   Torpy, A ^a  

^a RMIT UNIVERSITY   (Australia)

^b UNIVERSITY OF SYDNEY   (Australia)

^c ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODES; ELECTRIC ARCS; FILM GROWTH; INTERFACIAL ENERGY; ION IMPLANTATION; MATHEMATICAL MODELS; MICROSTRUCTURE; NITRIDES; PROBABILITY DENSITY FUNCTION; STOICHIOMETRY; STRESS ANALYSIS; VAPOR DEPOSITION;

BULK STRAIN ENERGY; CATHODIC ARC VAPOR DEPOSITION; DENSITY FUNCTIONAL THEORY; PLASMA IMMERSION ION IMPLANTATION;

THIN FILMS;

EID: 24144433826     PISSN: 09538984     EISSN: None     Source Type: Journal    
DOI: 10.1088/0953-8984/17/17/029     Document Type: Article

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