Advanced Al contact fill investigations

Advanced Metallization Conference (AMC)

Volumn , Issue , 2004, Pages 333-339

  Hahn, J ^a   Schmidbauer, S ^a   Witnik, O ^b   Yoon, K H ^b   Preuss, A ^b   Zitzelsberger, A ^a   Kahler, U ^a   Efferenn, D ^a   Cai, M ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN BOUNDARIES; METALLIZING; MICROELECTRONICS; PHYSICAL VAPOR DEPOSITION; RELIABILITY; THIN FILMS;

ALUMINUM PROCESSING; CONTACT FILLING; CONTACT RESISTANCE; VOID FREE CONTACT;

ALUMINUM;

EID: 23844539306     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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8. K. Hirose et al., Surface Melting Model for Al Reflow into Submicron Contact-holes and Vias, Proceedings IEDM 1994, p. 557