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Volumn , Issue , 1994, Pages 557-560
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Surface melting model for Al reflow into submicron contact-holes and vias
a
a
NEC CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
COMPUTATIONAL FLUID DYNAMICS;
FLOW OF FLUIDS;
LIQUID METALS;
MASS TRANSFER;
MATHEMATICAL MODELS;
SURFACE TENSION;
SURFACES;
THERMAL EFFECTS;
THREE DIMENSIONAL;
ALUMINUM REFLOW;
SUBMICRON CONTACT HOLES;
SURFACE MELTING MODEL;
VIAS;
METAL MELTING;
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EID: 0028735421
PISSN: 01631918
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (4)
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References (9)
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