A high aspect ratio sub 0.2 micron al plug technology for 0.13μm generation

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 209-211

  Yang, Tsung Ju ^a   Ku, Tzu Kun ^a   Lee, Tze Liang ^a   Tsui, Bing Yue ^a   Chen, Lai Juh ^a   Hsia, Chin ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; DEPOSITION RATES;

CLUSTER TOOL; HIGH ASPECT RATIO; LONG THROW SPUTTERING; VIA CHAIN; VIA RESISTANCE; WETTING CAPABILITIES;

ASPECT RATIO;

EID: 33645347276     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787124     Document Type: Conference Paper

References (3)

1. L. A, Clevenger, et al., IITC 1998, pp. 137-139.
2. N. Nakamura, et al, IITC 1998, pp. 143-145.
3. T. K. Ku, et al, IITC 1998, pp. 226-228.