Fracture of a lead-tin and a tin-silver solder under combined tensile shear loading

Materials Research Society Symposium - Proceedings

Volumn 563, Issue , 1999, Pages 15-20

  Manoharan, M ^a   Siow, K S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; FRACTURE MECHANICS; LEAD ALLOYS; SHEAR STRESS; SOLDERING ALLOYS; STRUCTURAL LOADS; TENSILE STRESS; TIN ALLOYS;

MIXED MODE FRACTURE MECHANISM;

ELECTRIC CONTACTS;

EID: 0033284750     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-563-15     Document Type: Article

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