A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 253-257

  Hu, C K ^a   Canaperi, D ^a   Chen, S T ^b   Gignac, L M ^a   Herbst, B ^a   Kaldor, S ^b   Liniger, E ^a   Rath, D L ^a   Restaino, D ^b   Rosenberg, R ^a   Rubino, J ^a   Simon, A ^b   Smith, S ^a   Tseng, W T ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DAMASCENE LINES; FAST PATH DIFFUSION; FOCUSED ION BEAM (FIB) MICROSCOPY; SHARP RESISTANCE;

COPPER; ELECTROMIGRATION; PERMITTIVITY; TANTALUM COMPOUNDS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

OPTICAL INTERCONNECTS;

EID: 23844489446     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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