Laser created silicon vias for stacking dies in MCMs

IEEE/CHMT European International Electronic Manufacturing Technology Symposium

Volumn , Issue , 1991, Pages 262-265

  Lee, Rex A ^a   Whittaker, Dennis R ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING - DESIGN; ELECTRONICS PACKAGING - MODULAR CONSTRUCTION; INTEGRATED CIRCUITS, WSI - DESIGN;

3-D CIRCUITS; ACTIVE DEVICES; MULTICHIP MODULES; SILICON VIAS;

DRILLING;

EID: 0025927285     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)