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Volumn 26, Issue 6, 2002, Pages 29-35

Influences of material source, wafer process and location on silicon die fracture strength

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; ELECTRONICS PACKAGING; FRACTURE TESTING; FRACTURE TOUGHNESS; RELIABILITY; STATISTICAL METHODS; SURFACES;

EID: 85047696669     PISSN: 07328818     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1747-1567.2002.tb00088.x     Document Type: Article
Times cited : (1)

References (10)
  • 1
    • 0027658454 scopus 로고
    • Experimental and analytical studies of 304-Pin, 0.5mm Pitch, 40mm body size plastic quad flat pack (QFP) solder joints and leads under Bending, twisting, and thermal conditions
    • Lau, J. H., and Erasmus, S., "Experimental and Analytical Studies of 304-Pin, 0.5mm Pitch, 40mm Body Size Plastic Quad Flat Pack (QFP) Solder Joints and Leads Under Bending, Twisting, and Thermal Conditions," J. Electron. Packag., Trans. ASME, 115, 322-328, 1993.
    • (1993) J. Electron. Packag., Trans. ASME , vol.115 , pp. 322-328
    • Lau, J.H.1    Erasmus, S.2
  • 2
    • 0029464180 scopus 로고
    • Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibration conditions
    • Lau, J. H., "Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibration Conditions," Proc. Japan Int. Electro. Manuf. Technol. Symp., 13-19, 1995.
    • (1995) Proc. Japan Int. Electro. Manuf. Technol. Symp. , pp. 13-19
    • Lau, J.H.1
  • 3
    • 0029390563 scopus 로고
    • Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions
    • Lau, J., Gratalo, K., Schneider, E., Marcotte, T. and Baker, T., "Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions," Circuit World, 22, 27-32, 1995.
    • (1995) Circuit World , vol.22 , pp. 27-32
    • Lau, J.1    Gratalo, K.2    Schneider, E.3    Marcotte, T.4    Baker, T.5
  • 5
    • 0031999316 scopus 로고    scopus 로고
    • Investigation of interfacial fracture behavior of a flip-chip package under a constant concentrated load
    • Wang, J. J., Lu, M. F., Zou, D. G. and Liu, S., "Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load," IEEE Trans. Comp. Packag. Manufact. Technol., 21, 79-86, 1998.
    • (1998) IEEE Trans. Comp. Packag. Manufact. Technol. , vol.21 , pp. 79-86
    • Wang, J.J.1    Lu, M.F.2    Zou, D.G.3    Liu, S.4
  • 8
    • 4243749971 scopus 로고    scopus 로고
    • Experimental and characterization methodologies in electronic packaging applications
    • Seminar Report, Advanced Interconnect Systems Laboratories Motorola Semiconductor Products Sector
    • Guo, Y. F., Experimental and Characterization Methodologies in Electronic Packaging Applications, Seminar Report, Advanced Interconnect Systems Laboratories Motorola Semiconductor Products Sector, 1998.
    • (1998)
    • Guo, Y.F.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.