-
1
-
-
0027658454
-
Experimental and analytical studies of 304-Pin, 0.5mm Pitch, 40mm body size plastic quad flat pack (QFP) solder joints and leads under Bending, twisting, and thermal conditions
-
Lau, J. H., and Erasmus, S., "Experimental and Analytical Studies of 304-Pin, 0.5mm Pitch, 40mm Body Size Plastic Quad Flat Pack (QFP) Solder Joints and Leads Under Bending, Twisting, and Thermal Conditions," J. Electron. Packag., Trans. ASME, 115, 322-328, 1993.
-
(1993)
J. Electron. Packag., Trans. ASME
, vol.115
, pp. 322-328
-
-
Lau, J.H.1
Erasmus, S.2
-
2
-
-
0029464180
-
Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibration conditions
-
Lau, J. H., "Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibration Conditions," Proc. Japan Int. Electro. Manuf. Technol. Symp., 13-19, 1995.
-
(1995)
Proc. Japan Int. Electro. Manuf. Technol. Symp.
, pp. 13-19
-
-
Lau, J.H.1
-
3
-
-
0029390563
-
Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions
-
Lau, J., Gratalo, K., Schneider, E., Marcotte, T. and Baker, T., "Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions," Circuit World, 22, 27-32, 1995.
-
(1995)
Circuit World
, vol.22
, pp. 27-32
-
-
Lau, J.1
Gratalo, K.2
Schneider, E.3
Marcotte, T.4
Baker, T.5
-
4
-
-
0029696534
-
Reliability characterization of the SLICC package
-
Lall, P., Gold, G., Miles, B., Banerji, K., Thompson, P., Koehler, C. and Adhihetty, I., "Reliability Characterization of the SLICC Package," Proc. Electron. Compon. Technol. Conf., 1202-1210, 1996.
-
(1996)
Proc. Electron. Compon. Technol. Conf.
, pp. 1202-1210
-
-
Lall, P.1
Gold, G.2
Miles, B.3
Banerji, K.4
Thompson, P.5
Koehler, C.6
Adhihetty, I.7
-
5
-
-
0031999316
-
Investigation of interfacial fracture behavior of a flip-chip package under a constant concentrated load
-
Wang, J. J., Lu, M. F., Zou, D. G. and Liu, S., "Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load," IEEE Trans. Comp. Packag. Manufact. Technol., 21, 79-86, 1998.
-
(1998)
IEEE Trans. Comp. Packag. Manufact. Technol.
, vol.21
, pp. 79-86
-
-
Wang, J.J.1
Lu, M.F.2
Zou, D.G.3
Liu, S.4
-
6
-
-
0031385088
-
Die strength evaluation in the presence of edge cracks
-
Sponsored by: ASME Fairfield NJ USA
-
Guo, Y.F., "Die Strength Evaluation in the Presence of Edge Cracks," ASME, Appl. Mech. Division, AMD Application of Fracture Mechanics in Electron. Packag. Proc. of the 1997 ASME Int. Mech. Eng. Congress and Exposition, Dallas, TX, USA, Sponsored by: ASME Fairfield NJ USA, 222, 125-131, 1997.
-
(1997)
ASME, Appl. Mech. Division, AMD Application of Fracture Mechanics in Electron. Packag. Proc. of the 1997 ASME Int. Mech. Eng. Congress and Exposition, Dallas, TX, USA
, vol.222
, pp. 125-131
-
-
Guo, Y.F.1
-
7
-
-
0031620191
-
Thermomechanically reliability assessment of large organic flip-chip ball grid array packages
-
Sylvester, M. F., Banks, D. R., Kern, R. L. and Pofahl, R.G., "Thermomechanically Reliability Assessment of Large Organic Flip-Chip Ball Grid Array Packages," Proc. Electron. Compon. Technol. Conf., 851-860, 1998.
-
(1998)
Proc. Electron. Compon. Technol. Conf.
, pp. 851-860
-
-
Sylvester, M.F.1
Banks, D.R.2
Kern, R.L.3
Pofahl, R.G.4
-
8
-
-
4243749971
-
Experimental and characterization methodologies in electronic packaging applications
-
Seminar Report, Advanced Interconnect Systems Laboratories Motorola Semiconductor Products Sector
-
Guo, Y. F., Experimental and Characterization Methodologies in Electronic Packaging Applications, Seminar Report, Advanced Interconnect Systems Laboratories Motorola Semiconductor Products Sector, 1998.
-
(1998)
-
-
Guo, Y.F.1
|