Influences of material source, wafer process and location on silicon die fracture strength

Experimental Techniques

Volumn 26, Issue 6, 2002, Pages 29-35

  Liu, D S ^a   Shih, Y S ^a   Ni, C Y ^a   Chiou, D Y ^a   Chung, C L ^b   Huang, M L ^c  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

^c Southern Taiwan Science Park   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; ELECTRONICS PACKAGING; FRACTURE TESTING; FRACTURE TOUGHNESS; RELIABILITY; STATISTICAL METHODS; SURFACES;

BENDING TEST; DIE FRACTURE STRENGTH; MATERIAL SOURCE; SURFACE CRACKS; WAFER PROCESS;

SILICON WAFERS;

EID: 85047696669     PISSN: 07328818     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1747-1567.2002.tb00088.x     Document Type: Article

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