Solder-paste/shape memory alloy composite for adaptive solder joint

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2779, Issue , 1996, Pages 475-480

  Trombert, S ^a   Chazelas, Jean ^a   Bonniau, P ^a   Van Moorleghem, W ^a   Chandrasekaran, M ^a   Silvain, J F ^a  

^a THALES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADAPTIVE SYSTEMS; ELASTICITY; INTELLIGENT MATERIALS; NICKEL ALLOYS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; STRESSES; TENSILE TESTING; THERMAL EXPANSION; TIN ALLOYS;

SOLDER PASTES; SUPERELASTIC ALLOYS;

SHAPE MEMORY EFFECT;

EID: 0029709962     PISSN: 0277786X     EISSN: None     Source Type: None    
DOI: 10.1117/12.237163     Document Type: Conference Paper

References (5)