Relaxation of thermal stress by dislocation motion in passivated metal interconnects

Journal of Materials Research

Volumn 19, Issue 4, 2004, Pages 1216-1226

  Nicola, Lucia ^a   Van Der Giessen, Erik ^a   Needleman, Alan ^b  

^a UNIVERSITY OF GRONINGEN   (Netherlands)

^b Brown University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER ALLOYS; DISLOCATIONS (CRYSTALS); ELASTICITY; GRAIN SIZE AND SHAPE; PASSIVATION; PLASTIC DEFORMATION; SEMICONDUCTING SILICON; SINGLE CRYSTALS; STRESS RELAXATION; SUBSTRATES; THERMAL STRESS;

EDGE DISLOCATION; METAL INTERCONNECTS; PASSIVATION LAYER; PASSIVATION LAYER THICKNESS; PITCH LENGTH; PLANE ORIENTATION; THERMAL STRESS RELAXATION;

ALUMINUM ALLOYS;

EID: 2342525862     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0158     Document Type: Article

References (14)

1. A. Saerens, P. Van Houtte, and A. Witrouw, Internal stresses in aluminum interconnects, Mater. Sci. Forum 347, 556 (2000).
2. P.A. Flinn and C. Chiang, X-ray diffraction determination of the effect of various passivations on stress in metal films and patterned lines, J. Appl. Phys. 67, 2927 (1990).
3. I-S. Yeo, S.G.H. Anderson, and P.S. Ho, Characteristics of thermal stresses in Al(Cu) fine lines. Passivated lines structures, J. Appl. Phys. 78, 953 (1995).
4. A. Wikström and P. Gudmundson, Stresses in passivated lines from curvature measurements, Acta Mater. 48, 2429 (2000).
5. M.A. Moske, P.S. Ho, D.J. Mikalsen, J.J. Cuomo, and R. Rosenberg, Measurement of thermal stress and stress relaxation in confined metal lines. Stresses during thermal cycling, J. Appl. Phys. 74, 1716 (1993).
6. S. Krämer, J. Mayer, C. Witt, A. Weickenmeier, and M. Rühle, Analysis of local strain in aluminium interconnects by energy filtered CBED, Ultramicroscopy 81, 245 (2000).
7. Y-L. Shen, Modeling of thermal stresses in metal interconnects: Effects of the aspect ratio, J. Appl. Phys. 82, 1578 (1997).
8. T-S. Park and S. Suresh, Effects of line and passivation geometry on curvature evolution during processing and thermal cycling in copper interconnects lines, Acta Mater. 48, 3169 (2000).
9. P. Gudmundson and A. Wikström, Stresses in thin films and interconnect lines, Microelectron. Eng. 60, 17 (2002).
10. A. Gouldstone, Y-L. Shen, S. Suresh, and C.V. Thompson, Evolution of stress in passivated and unpassivated metal interconnects, J. Mater. Res. 13, 1956 (1998).
11. J.R. Rice, Tensile crack tip fields in elastic-ideally plastic crystals, Mech. Mater. 6, 317 (1987).
12. L.P. Kubin, G. Canova, M. Condat, B.Devincre, V. Pontikis, and Y. Bréchet, Dislocation microstructures and plastic flow: A 3D simulation, Solid State Phenomena 23-24, 455 (1992).
13. L. Nicola, E. Van der Giessen, and A. Needleman, Discrete dislocation analysis of size effects in thin films, J. Appl. Phys. 93, 5920 (2003).
14. E. Van der Giessen and A. Needleman, Discrete dislocation plasticity: A simple planar model, Model. Simul. Mater. Sci. Eng. 3, 689 (1995).